成都尚明工業(yè)有限公司創(chuàng)建于1989年，位于國家級經(jīng)濟技術(shù)開區(qū)內(nèi)(龍泉驛區(qū)龍泉鎮(zhèn)星光中路靈池街)，占地25畝，專業(yè)從事半導體模具的設(shè)計和制造。經(jīng)過二十年的發(fā)展，已形成了集開發(fā)、制造為一體的專業(yè)化規(guī)模經(jīng)營。公司于2001年通過ISO9001：2000質(zhì)量體系認證;于2003年4月及2009年1月兩次被四川省科技廳授予“高新技術(shù)企業(yè)”。

公司模具中心配置日本產(chǎn)精密檢測設(shè)備，擁有美國MOORE和國產(chǎn)精密坐標磨床、日本產(chǎn)和國產(chǎn)精密坐標鏜床、瑞士夏米爾和日本沙迪克產(chǎn)精密慢走絲線切割機床、日本沙迪克精密坐標電火花機床、德國產(chǎn)數(shù)控銑床、日本產(chǎn)光學曲線磨床、成型磨床及日本產(chǎn)電火花加工機床、快走絲線切割加工機床等精密加工設(shè)備;可提供高精度的半導體塑封模具、切筋切斷模具、高速沖壓模具、各型精密模具備件。

公司立足于“誠信、服務(wù)、尊重、發(fā)展”的宗旨，按照“科學管理、求實創(chuàng)新、為顧客提供滿意的產(chǎn)品和服務(wù)”的質(zhì)量方針，堅持持續(xù)改進的原則，確保產(chǎn)品質(zhì)量和售后服務(wù)，滿足顧客的最高要求和期望。

公司致力于半導體模具的研究開發(fā)、生產(chǎn)制造及相關(guān)服務(wù)。通過不斷創(chuàng)新，加快產(chǎn)品更新速度，提高產(chǎn)品技術(shù)含量，確保公司在國內(nèi)封裝模具領(lǐng)域的領(lǐng)先地位，抓住中國入世機遇，加強與國內(nèi)高校及國際先進封裝企業(yè)的合作，提高企業(yè)競爭力和國際市場占有率，隨著微電子工業(yè)的發(fā)展而不斷壯大。

Chengdu Shangming Industrial Co., Ltd., located in a national economic and technological development zone (No.6, Lingchi Street, Middle Xingguang Road, Longquanyi District), was established in 1989. The company is specialized in design and manufacturing of semiconductor plastic package moulds and automated die-cutting & shaping system with an area of 25 mu and 140 employees. With the development for over 20 years, it has become an integrated company of development and manufacture and formed a diversified operation mode. It was awarded ISO9001:2000 quality system certificate in 2001, and has been awarded as “hi-tech enterprise” by Science & Technology Department of Sichuan Province many times since 2003.

The company is committed to the research and development of semiconductor plastic package moulds and automated die-cutting & shaping system, and constant innovation, speeding up the product updating and improving the product technology content to ensure its leading position in the domestic packaging mould field. It has seized the opportunity of China’s entry into WTO and strengthened cooperation with domestic colleges and universities and international advanced packaging enterprises, and enhanced the competitiveness of enterprises and the international market share. It keeps growing with the development of microelectronics industry.